منابع مشابه
Mechanisms and solutions to the brittle solder joint in electroless Ni plating
Brittle solder joints in Electroless Ni electroless Pd immersion Au (ENEPIG) surface finishes are one of the key re liability issues in electronics assembly. Previous characterization of the reflow process has indicated that interfa cial voids formed after solder reflow are responsible for the decreases in solder joint strength. However, the mechanisms behind the formation of these voids in t...
متن کاملThe Root Cause of Black Pad Failure of Solder Joints with Electroless Ni/Immersion Gold Plating
This paper reports on a study of the reaction of solder with the electrolessnickel with immersion gold (ENIG) plating system, and the resulting interfacial structures. A focused-ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the ENIGplated pad with and without soldering. High-speed pull testing of solder joints was performed to expose the pad sur...
متن کاملElectroless Nickel Plating with Hypophosphite
In the previous chapter, the components of electroless nickel plating baths were discussed from the viewpoint of the function each performs in the bath, with little attention paid to their effect on the plating process. The metal and the electron source (the reducing agent) are consumed in the electroless plating reaction and so their concentrations in the bath are continuously decreasing. Ther...
متن کاملElectroless Nickel Plating: Bath Control
In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nic...
متن کاملElectroless Nickel Plating on Magnesium Alloy
he inherent lightness and good strength-to-weight ratio of T magnesium has focused attention on increasing applications in aerospace and allied fields. Its density is two thirds that of aluminum-a conventional structure material for aerospace. Magnesium has one drawback: It is prone to atmospheric corrosion. Further, because of its high chemical affinity for aqueous solutions, it is categorized...
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ژورنال
عنوان ژورنال: Circuit Technology
سال: 1991
ISSN: 1884-118X,0914-8299
DOI: 10.5104/jiep1986.6.6_299